Lead PCB layer stack-up design and optimization
Perform waveform integrity, crosstalk, timing, eye diagram, and jitter analysis
Conduct power integrity analysis including DC IR drop and decoupling strategy optimization
Model insertion and return loss and support EMC analysis
Use industry tools such as Cadence Sigrity, HSPICE, ADS, HFSS, and Hyperlynx for simulation and analysis
Support and execute lab validation using TDR, vector network analyzers, spectrum analyzers, and high-speed oscilloscopes
Estimate turnkey projects and execute work from concept through development, lab testing, and final product delivery
Collaborate with cross-functional teams including hardware, layout, FPGA, and system engineers to ensure SI/PI best practices are embedded early in the design cycle

MS or PhD in Electrical/Electronics Engineering
Minimum five (5) years of experience designing and analyzing high-speed circuits or RF structures
Strong background in signal integrity, power integrity, electromagnetics, RF, antennas, or EMC
Hands-on experience with high-speed interfaces such as DDR memory and SERDES
Proficiency with SI/PI simulation and analysis tools such as Cadence Sigrity, HSPICE, ADS, HFSS, and Hyperlynx
Solid lab validation experience using tools such as TDR, vector network analyzers, spectrum analyzers, and high-speed oscilloscopes
Strong communication skills with the ability to interact effectively with customers and cross-functional teams
Comfortable adapting to new technologies and working across diverse industries
Committed to disciplined engineering practices and delivering high-quality designs

Fidus Systems

Open Positions (1)