Collaborating with customers on their IC package product requirements and solutions.
Defining test vehicles to deliver the vital advanced IC package design rules, new materials, and integrations.
Providing consultation on IC package design, thermal, electrical, mechanical, reliability, and cost considerations.
Working with a diverse multi-functional team in Micron.
Contributing to the alignment between product market development, die and IC package design, and chip to package interactions.
Engaging datacenter and business partners in systems requirements for end application and translating into package product technical requirements' definition (thermal, mechanical, reliability and aspects of electrical).
Defining memory package design rule roadmap for wirebond and TSV stacked memory applications.
Leading a design and development team for test vehicle definition and execution to achieve roadmap requirements and validation ahead of go-to-market product timelines.
Collaborating with Business, Product Engineering and field teams to guide package products from concept to mass production.

Bachelor’s degree in physics, Materials Science, Mechanical Engineering, Chemical Engineering, or Electrical Engineering; advanced degrees (MS, PhD) are preferred.
10+ years of proven experience in related fields.
Documented record of technical expertise and innovation resulting in high impact results; publications, patents; and track record of technical leadership and mentoring.
Proven leadership in leading multi-functional teams to achieve timely technical goals while maintaining a high standard of excellence.
A keen understanding of IC packaged product solutions (TSV, Discrete, PoP, FOP, InFo, MEP) and the system integrations used in the top datacenter makers in the US.
Excellent English interpersonal skills.
Familiarity with datacenter company cultures.
Skilled in interpreting sophisticated design and simulation data across multiple engineering domains.

Technical Package Product Manager – Member of Technical Staff

Key skills