Design high-power electronics/RF modules, enclosures and LRUs to withstand exposure to shock, vibration, humidity, salt fog, temperature and altitude extremes, and be compliant with EMI/EMC requirements.
Detailed design of power and signal distribution (wire harness/cables, coax cables, waveguides).
Conduct FEA simulations of PCBAs to predict PCBA and electrical component junction/channel temperatures and derive/implement thermal control schemes (forced air and liquid cooling).
Collaborate with RF, Electrical, Test and Manufacturing Engineers, and Program Management.
Conduct and lead peer and program design reviews.
Compose and maintain bills of materials (BOM) and be responsible for revision/version control of the same.
Compose design verification test plans (DVT) and qualification test plans.

BS/MS in Mechanical Engineering.
12+ years’ experience developing RF hardware and electronics enclosures for defense, aerospace, radar, or similar applications.
Proficiency with CAD tools (SolidWorks preferred), FEA stress and thermal simulations (Ansys preferred) and computational fluid dynamics (CFD) tools (Ansys and/or Flotherm preferred).
Experience designing and implementing forced-air convection cooling and liquid cooling of high-powered electronics.
Strong background in structural, thermal, and vibration FEA analysis of RF and electronics.
Practical experience translating MIL-STD-461, MIL-STD-810 and DO-160 requirements into compliant electronics enclosures designs.
This position requires a Security Clearance. Applicant must be a US Citizen and have the ability to obtain and maintain a US Government security clearance.

Principal Mechanical Design Engineer

Key skills