Work with a team of engineers in integration/photo/ICP/materials/plating/CMP/wetetch process to deliver advanced writers with designed magnetic, electrical, and thermo-mechanical performance for the next generation products.
Participate in hands-on investigation and resolution of process issues with frequent factory-floor presence.
Provide hands on work in a clean room environment and failure analysis for engineers providing FIB cuts, SEM inspections and other engineering requests.
Assist with performing MDA’s and dispositioning of wafers with guidance from engineers.
Consistently work on complex assignments requiring independent action and a high degree of initiative to resolve issues.
Make recommendations for new procedures.
Requirements
Experience working assignments requiring initiative and make recommendations for solutions.
Knowledge of basic analysis and presentation software (Excel, Powerpoint,…)
Associate's Degree with minimum of 2 ‐ 4 years of related clean room experience.
Knowledge of thin film recording head processing is preferred but not required.
Hands-on experience in thin film processing is preferred.
Knowledge of factory information systems preferred but not required (MES, Xsite, SPC).
Benefits
medical, dental, vision, and life insurance
short
and long-term disability
eligibility to participate in discretionary bonus program