Engineering Specialist – III

Role Overview

• Work with a team of engineers in integration/photo/ICP/materials/plating/CMP/wetetch process to deliver advanced writers with designed magnetic, electrical, and thermo-mechanical performance for the next generation products.
• Participate in hands-on investigation and resolution of process issues with frequent factory-floor presence.
• Provide hands on work in a clean room environment and failure analysis for engineers providing FIB cuts, SEM inspections and other engineering requests.
• Assist with performing MDA’s and dispositioning of wafers with guidance from engineers.
• Consistently work on complex assignments requiring independent action and a high degree of initiative to resolve issues.
• Make recommendations for new procedures.

Requirements

• Experience working assignments requiring initiative and make recommendations for solutions.
• Knowledge of basic analysis and presentation software (Excel, Powerpoint,…)
• Associate's Degree with minimum of 2 ‐ 4 years of related clean room experience.
• Knowledge of thin film recording head processing is preferred but not required.
• Hands-on experience in thin film processing is preferred.
• Knowledge of factory information systems preferred but not required (MES, Xsite, SPC).

Benefits

• medical, dental, vision, and life insurance
• short
• and long-term disability
• eligibility to participate in discretionary bonus program
• 401(k)
• employee stock purchase plan
• flexible and dependent care spending accounts
• health care spending accounts
• paid time off, including 12 holidays
• 120 hours of vacation
• a minimum of 48 hours of paid sick leave
• 16 weeks of paid parental leave