Collaborate with IFS Customer product design, internal product design, Silicon process development, Intel's Assembly Test Technology Development (ATTD), and Product Engineering teams to drive product architecture definition, product package design and execution.
Serve as the engineering interface to IFS Customers for packaging services to promote Intel packaging technologies, perform technical feasibility and risk assessments, analyze product ask vs. the ATTD packaging roadmap, and close the deal with the customer.
Drive Customer-facing technology reviews as the key engineering interface between the Customer and Intel Foundry, owning the Customer packaging engineering relationship from product concept through product mass production.
Work with IFS Business Development, ATTD, ATM, and Supply Chain to complete RFQ risk assessments and pricing assessments.
Capture customer feedback and competitive trends that can better inform the ATTD packaging roadmap.
Represent the customer in internal technology working groups for new technologies during pathfinding and development.

Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related STEM field.
9+ years of experience in semiconductor packaging
Hands-on experience in one or more of the following areas: Power delivery, High‑speed signaling, Thermal‑mechanical analysis, Process development, Die disaggregation architectures
Experience presenting technical information to external customers and suppliers.

Packaging Customer Engineer

Key skills