Work with cross-functional hardware engineering teams to develop advanced microelectronics packages including 3DHI, 3D, and 2.5D (interposer + chiplets) and novel material and process solutions for RF, digital, mixed-signal, and photonics products
Leverage industry-leading manufacturing and novel materials to achieve new levels of electro-mechanical performance and reliability
Requirements
Typically requires a Bachelor’s Degree in a Science, Technology, Engineering & Math (STEM) Field
minimum of Eight (8) or more years of relevant experience (An advanced STEM degree could count for 3 years of experience)
Experience performing circuit layout design using 2D CAD tools
Experience with mechanical and electrical engineering design
The ability to obtain and maintain a US security clearance
U.S. citizenship is required as only U.S. citizens are eligible for a security clearance