Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages.
Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures.
Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations.
Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms.

PhD Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics
3+ years of Thermal-mechanical work/research experience with emphasis on silicon reliability
3+ years of experience with Finite Element Analysis tools
3+ years of experience with experimental material characterization metrologies such as DMA/TMA and nano-indentation.
Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis
Experience with designing, planning and executing experiments

Semiconductor Packaging Mechanical Engineer

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