Lead and continually improve the site’s Quality Management System aligned with defense and aerospace standards.
Oversee quality engineering activities for hybrid microelectronic assembly, including die attach, wire bonding, substrate processes, sealing, and qualification.
Own nonconformance management, corrective actions, and structured root‑cause analysis.
Manage calibration, process validation, equipment qualification, and in‑process/final inspection.
Serve as the primary customer‑facing quality representative and lead audit readiness.
Prepare First Article Reports, qualification plans, and failure analysis documentation.
Oversee supplier quality, incoming inspection, and corrective actions.
Lead reliability test planning, including environmental, mechanical, and burn‑in testing.
Build, mentor, and support a high‑performing team across engineering and inspection.
Drive continuous improvement using Lean, Six Sigma, and data‑based decision making.

Leadership, problem‑solving, and cross‑functional communication skills – required
Experience leading quality engineering or quality assurance teams – required
Background in hybrid microelectronics, semiconductors, aerospace, or high‑reliability manufacturing – required
Expertise in MIL PRF 38534 and related defense standards – required
Knowledge of hybrid assembly processes (die attach, wire bond, sealing, substrate technology) – required
Bachelor’s degree in engineering or similar technical field – required
Experience with AS9100 or ISO 9001 Quality Management Systems – preferred
Six Sigma certification or experience with continuous improvement methodologies – preferred

Quality Manager – Hybrid Microelectronics, MIL PRF 38534

Key skills