Lead the thermal system and application architecture for Direct-to-Chip (D2C) liquid cooling solutions
Define and evaluate Direct-to-Chip liquid cooling architectures for AI/ML data centers
Understand and assess the complete thermal path: Chip, Package, TIM, Cold Plate, Coolant, CDU, Heat Rejection
Evaluate system-level trade-offs between thermal performance, cost, complexity, and scalability
Act as the technical contact for customers in AI/ML data center applications
Support customer discussions on cooling architecture selection
Translate customer requirements and use cases into technically sound system concepts
Provide technical credibility in customer meetings, workshops, and technical reviews

Bachelor's Degree in Mechanical Engineering, Physics, Material Sciences or related technical field
May consider relevant work experience in lieu of degree
Demonstrated experience in AI/ML data centers or HPC environments
Strong background in liquid cooling, ideally Direct-to-Chip
Excellent system-level and architectural thinking
Solid understanding of heat transfer and fluid flow principles at application level
Ability to make and justify technical design and component selection decisions
Excellent communication skills to clearly explain complex thermal system concepts to both technical and non-technical stakeholders, including customers

Thermal Engineering Architect

Key skills