About this role

design and optimize manufacturing processes for display and semiconductor manufacturing technologies
collect and analyze data, perform hardware characterization, and troubleshoot engineering issues
measure film properties, generate technical documentation, and engage with customers to resolve concerns
collaborate with vendors and suppliers
experiment and learn on state‑of‑the‑art equipment along with R&D teams

M.S. or Ph.D. in Materials Science, Electrical Engineering, Mechanical Engineering, Applied Physics, or a related STEM discipline
In‑depth knowledge and hands‑on experience in one or more of the following: Die‑to‑wafer or wafer‑to‑wafer bonding, Thin‑die handling and alignment‑critical processes, Semiconductor processing and 2.5D/3D integration
Strong understanding of: Bond interface physics, Alignment and overlay fundamentals, Mechanical behavior of thin and fragile dies
Proficiency in statistical analysis and process control (e.g., DOE, SPC, JMP)
Self‑starter with strong problem‑solving skills; able to work both independently and collaboratively
Strong communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams.

supportive work culture that encourages learning, development, and career growth
programs and support for health and wellbeing
opportunities for personal and professional growth

Process Engineer – Die to Wafer Hybrid Bonding, Silicon Photonics / CPO, R&D

Key skills