Hands-on development of applications for in-line metrology & inspection in semiconductor manufacturing using ZEISS’s FIB-SEM technology while based in Japan for a three-year assignment.
Operate the FIB-SEM systems in the customers’ clean room environments in Japan.
Be an integral part of the engineering team in Japan and help drive the development of FIB-SEM technology.
Obtain first-hand knowledge of semiconductor FIB-SEM applications at Japanese customer sites and identify areas for improvement as well as new market opportunities.
Work jointly & hands-on with internal hardware and software development groups during the Japan assignment.
Provide technical guidance to Business Development Managers and the sales team while stationed in Japan.
Lead and perform customer (live) demos with customer samples and wafers at Japanese customer locations.
Your primary working location for the three-year assignment will be on the customer site in Japan. After the assignment, you will transition to a long-term role in the United States.

Experience with SEM imaging and an excellent understanding of the SEM imaging mechanisms.
Experience with FIB-SEM sample preparation will be an advantage.
Demonstrated ability in the development of new processes or methodologies using FIB-SEM or SEM instruments.
Experience in Design of Experiments (DOE) and Statistical Process Control (SPC).
Knowledge of coding in Python or any other programming language which can be used for data analytics or image processing is a big advantage.
Excellent communication skills, self-direction, integrity, positive thinking, a strong desire to learn, and good teamwork.
Open to international travel and the experience to work in other semiconductor fabs (USA, S. Korea, Taiwan, China and Japan).
Bachelor or Master Degree in Engineering, Material Science, Physics or Chemistry.
Fluency in Japanese, both written and verbal, is required.

Applications Engineer – 3D Tomography

Key skills