Own System IC Architecture, to define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions
Develop and maintain long-term product and technology roadmaps in collaboration with product line leaders and R&D teams
Translate customer requirements into innovative packaging and power management solutions
Partner with system solution architects and IC product architects to ensure solutions meet stringent performance, efficiency, space, and cost targets
Lead integration of ICs and power semiconductors into advanced packages and systems
Analyze customer-specific needs to deliver optimized power efficiency and thermal management strategies for enhanced reliability
Collaborate with system, modeling, design, packaging and manufacturing engineering teams to validate and optimize high-performance compute Power designs
Provide strategic insights on state-of-the-art power management technologies and benchmark readiness

Master’s degree in Power Electronics, Electrical Engineering, or related field (Ph.D. preferred)
15+ years of experience in power semiconductors, packaging, and system-level integration
Expertise in System-in-Package (SiP) integration
Proven track record in product definition through revenue realization
Strong expertise in thermal management, electrical performance, and advanced reliability
Proficiency in circuit simulation tools (e.g., Cadence Spectre, PSPICE, HSPICE, Saber, Simetrix/Simplis, Verilog-AMS)
Knowledge of PCB materials and stack-up
Experience in Powering high performance compute SoC platforms, with automotive-grade standards highly valued
Experience in systems developed according to Functional Safety standard is a plus (ISO26262 and/or IEC61508)
Demonstrated ability to lead cross-functional, global teams and manage complex projects
Excellent communication and interpersonal skills

System IC Architect – Advanced Power Systems

Key skills