About this role
Role Overview
- Lead signal integrity channel analysis for 2.5D and 3D silicon interposers, including frequency
- and time-domain evaluation
- Define and drive power delivery architecture, impedance targets, and transient analysis
- Perform electromagnetic extraction and modeling across PCB, package, and interposer designs
- Establish SI/PI standards, methodologies, and sign-off criteria for HBM system designs
- Provide clear technical direction in ambiguous or incomplete design environments
Requirements
- 7 years of experience in signal integrity and power integrity modeling and analysis
- Strong understanding of SI/PI fundamentals, electromagnetics, transmission line theory, and I/O design
- Hands-on experience with industry-standard SI/PI EDA tools such as ANSYS, Synopsys, Cadence, or Keysight
Benefits
- Health insurance
- Dental and vision plans
- Income protection programs
- Paid family leave
- Paid time-off
- Paid holidays