Support cryogenic packaging and system co-optimization R&D using commercial multi-physics tools
Develop and correlate cryogenic thermal, mechanical, and/or electrical models for semiconductor devices and advanced packages
Anticipate integration/process issues based on information from integration, process or design enablement teams

M.S. + minimum of 10 years of relevant experience
Semiconductor mechanical, thermal, and/or electrical simulation tool experience with Ansys Mechanical Workbench or other applicable software
Strong problem solving and technical troubleshooting skills including expertise in design of experiment
Must have at least an overall 3.0 GPA and proven good academic standing
Language Fluency
English (Written & Verbal)
Solid understanding of semiconductor processes and integration techniques
Good computer/software skills
Ability to clearly present results to small and large groups
Travel
Up to 10%

Advanced Packaging Cryogenic Modeling Engineer

Key skills