Interface between Qorvo design community and worldwide supply base to create technology roadmaps to support future products.
Develop, qualify, and support clean launch of new laminate PCB material sets and suppliers in line with centralized Qorvo processes and documentation standards.
Design material and surface finish evaluations using screening tests and design of experiments to improve product attributes such as RF performance, MSL rating, lower cost, or size reduction.
Utilize program management methodology to plan, execute and monitor complex process and/or product development projects.
Apply problem solving skills and knowledge to solve challenges related to new technologies or improve existing supply chain capabilities.
Travel to laminate suppliers to provide technical support for technology development, supplier qualification and problem resolution.

0-2 years of experience in PCB and/or IC substrate manufacturing
Bachelor's degree in Chemistry or an Engineering discipline
Familiarity across a wide range of assembly/packaging process technologies and materials such as SMT, Die Attach, Wire Bond / Flip Chip, Molding, Multi-layer laminates, etc.
Experience with laminate/PCB manufacturing including processes such as Cu pattern plating, panel plating, via drill, surface finishes, etc.
Knowledge of dielectric materials such as prepreg, ABF, RCC, etc.
Recognized understanding of IPC PCB and JEDEC standards
Familiarity in PCB design rules, manufacturing and qualification standards.
Ability to utilize SPC techniques, DOE, and structured problem-solving methodologies (e.g. DMAIC, 8D).
Understanding of Design for Manufacturability and requirements needed to ramp technologies in a high volume-manufacturing environment.
Direct experience with Cu plating and/or surface finish plating.
Project management skills.
Experience in mSAP laminate fabrication for RF applications.

IC Substrate Development Engineer

Key skills