Develop and validate thermal solution for HPC cluster platforms with respect to industry standards
Evaluate all of the system layout, power consumptions, air flow, acoustics, sensors and related mechanical testing
Perform cluster level thermal analysis, definition, testing (including chamber test set up, thermocouple installation, automated data acquisition)
Thermal debugging, system optimization and documentation
Analyze structural and thermal aspects to ensure feasibility and specify thermal interface materials and manufacturing process
Responsible for development, design, documentation and deployment of all cluster level water cooling customer projects.
Additional responsibilities will include rack integration, documentation, facilities preparation, on-site service, & PM/Sales/Field Application Engineer customer project support.

Bachelor degree in Aerospace, Thermal, or Mechanical Engineering; Master’s degree is a plus
Minimum 1 year of experience in server/PC industry with mechanical or thermal function is required
Must have working knowledge in thermal management hardware, heat transfer material, and cooling devices at a rack/cluster level
Solid knowledge in general Mechanical/thermal engineering analysis, validation, documentation and communication
Knowledge of mechanical/thermals (cooling devices, air flow, temp, power, cooling, mechanical design) with electrical/power (power distribution, AC power types, power calculations, DC power, regulatory/safety) is a plus
Server/Rack Liquid Cooling solutions experiences are plus which include DCL(direct chip liquid cooling), rear door liquid cooling, liquid immersion cooling, chilled water piping, etc. is a plus
Must have good working spirit and work well in a team and fast-paced environment
Strong organizational and problem solving skills
Solid communication skills, both verbal and written
Able to travel for on-site customer deployments.

Thermal Engineer

Key skills