TenstorrentRemote
Chiplet Physical Design Engineer
United States
Full-time
2 weeks ago
$100,000 - $500,000 USD
H1B Sponsor Likely
Key skills
Physical design engineeringSynthesisplace-routeSynopsysCadence toolsTiming closure expertiseScripting TCLScripting PythonCollaborationCommunication skillsMentoringPythonRAICommunication
About this role
Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. As a Senior Chiplet Physical Design Engineer, you will work on designing and integrating multiple chiplets into a System-in-Package (SiP), collaborating with experts to deliver world-class CPU and AI silicon.
Responsibilities:
- Own critical aspects of synthesis and place-and-route for high-speed CPU core designs, contributing directly to performance, power, and area outcomes on advanced process nodes
- Thrive in complex, multi-stakeholder projects
- Drive detail-oriented ownership from synthesis through design closure
- Collaborate with team members and external partners to achieve project goals
- Mentor others and influence methodology within the team
Requirements:
- Bachelor's, Master's, or PhD in Electrical Engineering, Computer Engineering, or Computer Science
- 10+ years of industry experience in physical design for CPU, or GPU products
- Strong hands-on experience with Synopsys and/or Cadence tools across synthesis, P&R, and closure
- Proven expertise in timing closure, ECO flows, and PV convergence at block and chip level
- Proficiency in scripting (TCL required; Python or similar strongly preferred) and strong English communication skills