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The Robert Bosch GmbH is looking forward to your application!
The packaging of MEMS sensors, important components in automotive safety systems and consumer electronics, plays a significant role in ensuring mechanical stability, performance, and long-term reliability. The heterogeneous material composition of these packages leads to thermal expansion mismatches, which can cause high stresses at material interfaces under thermal loading. Although thermo-mechanical finite element simulations are an essential method for understanding stress formation and warpage, the results are influenced by numerical modeling decisions. Factors such as mesh density, element formulation, and solver algorithms can affect the predicted stresses and deformations, introducing model-form and numerical uncertainties that are often not systematically analyzed.
Start: according to prior agreement
Duration: 6 months
Requirement for this internship is the enrollment at university. Please attach your CV, transcript of records, enrollment certificate, examination regulations and if indicated a valid work and residence permit.
Diversity and inclusion are not just trends for us but are firmly anchored in our corporate culture. Therefore, we welcome all applications, regardless of gender, age, disability, religion, ethnic origin or sexual identity.
Need further information about the job?
Dharshan Barkur (Functional Department)
+49 7121 35 66938
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