Remote Senior Electro-Mechanical Engineer

Raytheon is dedicated to helping the nation and allies defend freedoms and deter aggression, leveraging over 100 years of engineering expertise. They are seeking a Senior Electro-Mechanical Engineer to develop advanced microelectronics packages and lead research efforts in cutting-edge technologies.

Responsibilities:

• Work with cross-functional hardware engineering teams to develop advanced microelectronics packages including 3DHI, 3D, and 2.5D (interposer + chiplets) and novel material and process solutions for RF, digital, mixed-signal, and photonics products
• Be involved in research efforts including initial concepts, advanced technology demonstrations, and will have the opportunity to follow product development from beginning to end, including documentation, fabrication, assembly, and test/delivery of a range of microelectronics products
• Follow established procedures in creation of technical data package work products, while working closely with program management and functional supervision to ensure the overall design objectives are met
• Ability to work independently and in a team environment, including as a leader of small teams semiconductor manufacturing processes and materials

Requirements:

• Typically requires a Bachelor's in Science, Technology, Engineering, or Mathematics (STEM) degree and a minimum of 5 years' prior relevant experience, to include any combination of the following:
• Experience in circuit layout design using 2D CAD tools
• Experience performing mechanical and electrical engineering design
• Experience with semiconductor manufacturing processes and materials
• Experience with high density microelectronic packaging designs including Interposers, organic substrates, wafer and chip bumping
• Experience with electronic components / devices such as ASICs and FPGAs
• Experience with the design of electronic packaging chassis and structures, interconnects (connectors/cables), and / or thermal management design of high-density electronic systems and electronic enclosures
• RF circuit design, including 3D EM simulation in HFSS or similar tools
• Circuit layout design experience using 2D and 3D CAD tools (Cadence Virtuoso and/or Allegro/APD+)
• Experience and familiarity with selection and oversight for semiconductor wafer processing and finishing (plating, bumping, dicing)
• Design experience with 3D and 2.5D packaging, complex CAD/EDA software design workflows, and RF/Thermal/Digital co-design
• Experience qualifying and implementing cutting edge materials, fabrication techniques, and understanding of relevant materials used in semiconductor manufacturing and packaging
• Strong background in development, documentation, fabrication, assembly, and test/delivery of military/defense and/or commercial state-of-the-art electronic products
• Experience with designing electronics for extreme environmental requirements and design constraints
• Proficiency with 3D Mechanical CAD modeling and analysis tools (e.g., Solidworks, Creo)
• Experience in Geometric Dimensioning and Tolerance analysis for drawings
• Possess an active security clearance