Substrate IC Package Design Engineer - Remote

Syenta is pioneering a new era in semiconductor manufacturing with groundbreaking technology. The role involves designing advanced substrate IC packages and multi-layered interposers, focusing on high-performance chip-to-chip integration and ensuring robust signal and power integrity.

Responsibilities:

• Design large (>50mm), complex multi-layer substrate interposers with high pin counts and dense routing requirements
• Develop high-speed signal routing solutions capable of supporting >50GHz performance while minimizing signal integrity issues such as loss and crosstalk
• Ensure robust signal integrity (SI) and power integrity (PI) across all designs
• Optimize designs for thermal performance and reliability
• Perform DRC (Design Rule Check) and LVS (Layout vs. Schematic) verification for all substrate designs
• Develop and maintain detailed design documentation, specifications, and reusable guidelines for future interposer and substrate development
• Work closely with global, cross-functional teams across engineering disciplines to ensure design feasibility, manufacturability, and performance
• Partner with process, materials, and hardware teams to align design with fabrication capabilities and constraints
• Contribute to the establishment of internal best practices for substrate and interposer design
• Provide expertise in advanced packaging design, helping build this capability within Syenta

Requirements:

• Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field
• 5+ years of experience in substrate IC package design for high-performance processors or accelerators
• Extensive experience designing large-format substrate packages (>50mm) with complex, high-density layouts
• Deep expertise in high-speed signal design, including mitigation of crosstalk, reflections, and impedance mismatches
• Advanced proficiency in Allegro Package Designer (constraint management, routing, and design verification)
• Strong understanding of SI/PI principles and their application to package-level design
• Solid foundational knowledge across electrical, materials, thermal, and/or mechanical engineering disciplines
• Working knowledge of substrate manufacturing processes, design rules, and material properties
• Strong analytical and problem-solving skills, with the ability to operate effectively in a fast-paced, cross-functional environment
• Familiarity with Valor CAM350 or Calibre for package design reviews
• Experience designing for advanced packaging architectures (e.g. multi-chip modules, interposers, or similar high-density systems)
• Experience working in high-growth or startup environments