Scalence L.L.C.Remote
Core Engineering - Design Engineer V
United States of America
Full Time
3 weeks ago
Visa Sponsor
Key skills
CCommunication
About this role
Scalence L.L.C. is seeking a Design Engineer V for their AR Product Team, focusing on complex PCB layouts. The role involves managing multiple projects, collaborating with cross-functional teams, and applying electrical engineering principles to ensure high-quality designs.
Responsibilities:
- Manage multiple complex layout projects, providing timely status reports within *** systems
- Lead designs from kick-off through tape-out, encompassing rigid, rigid-flex, and flex PCBs for both product and non-product/test projects
- Proactively schedule and drive project meetings (Kick-off, Placement, Constraint, and Design Reviews) to ensure design verification using ***'s Design Traveler document
- Create and modify engineering tool project templates, ***-data, configuration data, and rules
- Apply a solid understanding of electrical engineering principles, particularly for power distribution, high-speed circuits, and RF signals
- Identify project execution risks or slowdowns proactively and collaborate with managers and/or technical program managers to propose alternative PCB development workflow solutions
- Understand and propose practical fit and function solutions related to miniaturization concepts
- Proactively partner with EE Leads, Mechanical Engineering, TPMs, and other cross-functional teams (XFNs) to resolve design issues
- Work with internal DFM engineers to confirm supplier requirements at project launch
- Engage with external suppliers and Supplier Quality/Process Engineering (SQE/PE) to resolve DFM issues and ensure high-yield builds
Requirements:
- 8+ years of experience in complex PCB Design
- 5+ years of experience using Allegro PCB Design Tools (version 23.1 or newer)
- Strong understanding of the mechanical aspects of electronics design
- Excellent communication skills
- Proficiency with Client Office tools
- BS in Electrical Engineering
- 3+ years of experience implementing miniaturization solutions in dense form-factor designs (e.g., wearable products, mobile phone design)