ElectroMechanical Engineer Sr.

Lockheed Martin Missiles & Fire Control is a leader in aerospace and defense systems, seeking a Senior ElectroMechanical Engineer to join their Advanced Programs hardware engineering team. The role involves leading the development of electromechanical systems for missile and radar electronics while mentoring junior engineers and ensuring high-quality delivery of hardware.

Responsibilities:

• Lead hardware development and production teams, ensuring on time, high quality delivery of electromechanical hardware
• Design electromechanical systems for missile and radar electronics, including CCA/PWB packaging, harness assemblies, and electronic enclosures
• Produce detailed 3D models, 2D drawings, and layout schematics; select materials, components, and manufacturing processes that meet size, weight, power, and environmental constraints
• Serve as the Material Review Board (MRB) authority, making informed technical decisions and driving rapid issue resolution
• Define acceptance test criteria, execute verification tests, and document results for each hardware iteration
• Perform thermal, shock, vibration, and EMI analyses to ensure compliance with flight qualification standards
• Support program planning and work closely with senior management, production, quality, and customer stakeholders to meet cost, schedule, and technical requirements
• Provide technical guidance, mentorship, and career development for junior engineers; foster an inclusive, knowledge sharing environment
• Maintain configuration control and design documentation in Lockheed Martin PLM tools (Windchill, Creo)
• Participate in technical reviews, IRAD work, and other milestone activities; communicate status and risks clearly to all audiences

Requirements:

• Bachelor of Science degree in Electrical Engineering, Mechanical Engineering or related field
• Minimum 3 years of professional experience in Electromechanical Engineering or related discipline
• Experience with CREO and Windchill or equivalent CAD and PLM tools
• Experience with MFC circuit card and printed wiring board packaging design
• Experience with Technical Data Package generation, including BOM creation in Windchill, 2D drawings, and 3D modeling
• Working knowledge of GD&T (Geometric Dimensioning and Tolerancing)
• Excellent communication and interpersonal skills
• Experience working with defense customers
• The selected candidate must be able to obtain a secret clearance
• Prior knowledge of MFC programs (e.g., AVDS, VBK, MAPS)
• IRAD to LRIP transition experience
• Experience with electronics, machined components, test equipment, cable assemblies, and circuit cards
• Experience with military and aerospace specifications
• Ability to manage multiple assignments/programs
• Experience with Microsoft Office (Excel, Word, PowerPoint)
• Knowledge of Design Assurance processes
• Working knowledge of Zuken
• Flex circuit design experience