Thermal Systems Lead Engineer, Electrical & Power #3612559

Axiom Path is a global solutions provider leveraging AI and pre-built analytics to deliver exceptional services across various domains. The Thermal Systems Lead Engineer will influence cooling architecture for high-density compute environments, collaborating with various teams to develop advanced thermal systems and scalable solutions for data center cooling needs.

Responsibilities:

• Lead or support development of advanced thermal systems for data center, AI/HPC, hyperscale, and mission-critical applications
• Evaluate cooling architectures involving liquid cooling, direct-to-chip cooling, CDUs/TCS, cold plates, rack-level cooling, airside systems, chillers, dry coolers, heat exchangers, pumps, thermal storage, heat rejection, controls, and facility integration
• Translate high-density compute and infrastructure requirements into practical thermal system concepts and engineering requirements
• Assess tradeoffs across performance, reliability, redundancy, controls, serviceability, safety, energy efficiency, water usage, carbon impact, cost, and deployment readiness
• Support development of system concepts, reference designs, operating modes, control inputs, technical documentation, validation plans, and customer-facing materials
• Partner with product, engineering, modeling, controls, field, sales, manufacturing, vendors, and customers to guide scalable data center cooling solutions
• Use modeling, simulation, field data, lab testing, commissioning feedback, or performance analysis to improve system design and operation
• Provide technical guidance for strategic customer opportunities, industry discussions, internal design reviews, and commercialization activities
• Help mentor engineers and build organizational knowledge around emerging thermal systems and data center cooling technologies

Requirements:

• 8+ years of relevant engineering experience in thermal systems, data center cooling, mechanical systems, mission-critical infrastructure, power infrastructure, electronics cooling, HVAC, controls, modeling, or advanced product development
• Direct experience with data center, AI/HPC, hyperscale, colocation, mission-critical, high-density compute, or advanced cooling systems
• Strong system-level thinking with the ability to connect components into the broader cooling, power, controls, and facility architecture
• Hands-on experience with one or more of the following: liquid cooling, direct-to-chip cooling, cold plates, CDUs/TCS, rack-level cooling, airside cooling, heat rejection, chillers, dry coolers, pumps, heat exchangers, hydronic systems, power integration, controls, modeling, validation, or commissioning
• Ability to evaluate technical tradeoffs involving performance, reliability, efficiency, redundancy, cost, sustainability, safety, and deployment
• Experience creating or contributing to technical documentation such as design guides, requirements, test plans, operating modes, sequence-of-operation inputs, reference designs, white papers, or customer-facing technical materials
• Strong communication skills with the ability to present technical concepts to customers, leadership, engineering teams, field teams, vendors, and industry stakeholders
• Experience with modeling, simulation, validation, controls, field troubleshooting, commissioning, or system optimization is preferred
• Exposure to OCP, ASHRAE TC 9.9, IEEE, ASME, JEDEC, UL, NFPA, NEC, LEED, CEM, or similar standards / industry organizations is preferred
• Professional Engineering license, advanced degree, patents, publications, conference speaking, committee work, or technical presentations are helpful but not required