Embedded Software Engineer, Canada or US based role

Ciena is a global leader in high-speed connectivity, committed to a people-first approach. They are seeking an engaged and high-energy Software Engineer to contribute to firmware development for Optical Network Unit (ONU) systems, focusing on delivering reliable embedded software that supports next-generation intelligent networking solutions.

Responsibilities:

• Design and maintain embedded Linux firmware for OpenWrt-based ONU systems
• Implement PON subsystem software including XGS-PON registration, OMCI agent functionality, eOMCI, Active-Active coordination, and MIB synchronization
• Integrate Ethernet switching subsystems, including VLAN operations, port management, QoS classification, scheduling, shaping, and LACP
• Develop U-Boot bootloader extensions, firmware upgrade flows, and version management mechanisms
• Implement platform security capabilities including TPM 2.0 integration, Secure Boot, and OMCI-level encryption
• Develop and maintain OpenWrt package Makefiles, custom feeds, and build systems
• Execute code reviews, testing, and debugging from lab bring-up through field deployment

Requirements:

• Education: Master's degree in Computer Engineering, Electrical Engineering, Computer Science OR Bachelor's degree in Computer Engineering, Electrical Engineering, Computer Science
• 3+ years of experience in embedded software or firmware development
• Application of C programming for embedded or systems-level software; utilization of C++
• Application of embedded Linux including kernel drivers, device trees, init systems, and cross-compilation
• Utilization of OpenWrt or comparable embedded Linux build systems such as Yocto or Buildroot
• Application of networking fundamentals including Ethernet, VLANs, QoS, LACP, and TCP/IP
• Utilization of bootloaders including U-Boot and firmware lifecycle management processes
• Application of PON technologies including XGS-PON and GPON, and OMCI protocol stack (ITU-T G.988)
• Utilization of Marvell or Broadcom switching components or equivalent merchant silicon SDKs
• Application of TPM 2.0 integration or Secure Boot implementation in embedded platforms
• Utilization of NAND flash memory layouts, UBI/UBIFS, and MTD subsystems
• Application of inter-process communication methods including ubus, Unix sockets, and shared memory
• Application of CAN bus technologies