Mechanical Engineering Technical Leader

Cisco is a leading technology company focused on revolutionizing how data and infrastructure connect in the AI era. They are seeking a Mechanical Engineering Technical Leader to lead mechanical and thermomechanical simulation efforts for ASICs and complex silicon/package/board assemblies, ensuring product reliability for high-performance systems.

Responsibilities:

• Lead and perform advanced finite element analysis (FEA) to evaluate thermomechanical behavior and reliability of ASIC packages and board-level assemblies, including stress, warpage, and interconnect integrity
• Own and drive solder joint reliability assessments, including thermal cycling, mechanical shock, and vibration, and develop lifetime prediction methodologies
• Model and analyze nonlinear and time-dependent material behavior, including creep, viscoplasticity, and fatigue, with strong understanding of temperature and rate effects
• Define and establish simulation methodologies, modeling best practices, and correlation strategies for packaging and board-level reliability
• Drive correlation between simulation and reliability testing (e.g., TCT, drop, field returns) to improve predictive accuracy and enable design signoff
• Influence product design by providing data-driven recommendations, risk assessments, and reliability sign-off criteria early in the development cycle
• Lead root cause analysis for mechanical/reliability failures and guide cross-functional teams toward robust solutions
• Develop and scale simulation workflows and automation using Python, Fortran, or similar tools to improve team efficiency and consistency
• Communicate complex technical findings clearly to stakeholders across mechanical, packaging, and system teams

Requirements:

• Bachelors + 8 years, or Masters + 6 years, or PhD + 3+ years in mechanical engineering or related field
• Strong experience in thermomechanical simulation of semiconductor packages and/or board-level assemblies
• Proven track record in solder joint reliability analysis, including fatigue and/or creep modeling
• Deep hands-on experience with ABAQUS or ANSYS, including nonlinear material modeling
• Demonstrated ability to drive technical decisions and work across global teams
• Expertise in board-level reliability (BLR) and PCB–package interaction modeling
• Professional with solder constitutive models (e.g., Anand) and fatigue life prediction methods (Coffin-Manson, Darveaux)
• Knowledge of JEDEC/IPC standards for reliability qualification
• Experience with advanced packaging (flip chip, 2.5D/3D, heterogeneous integration)
• Track record of correlating simulation with test data and driving design improvements