Key skills
Silicon Photonics package designFlip chipFanout packagingThermo-compression bondingUnderfill processHot bar solderingWirebondingDie attachMicroelectronics packaging designOptoelectronics packaging designGlass/ceramic/metal material propertiesMultilayer materials interfacesHigh-volume optical transceiver packagingCo-packaged opticsMulti-chip module packagingPluggables packaging2.5D/3D packagingFabrication process documentationInspection process documentationAssembly process documentationPackage and process designSEM/XSEM metrologyConfocal microscopyAcoustic imagingAssemblyAICommunicationCollaboration
About this role
Nokia is a global leader in connectivity for the AI era, advancing connectivity to secure a brighter world. They are seeking a talented Packaging Development Engineer to lead the development of next-generation packaging solutions, collaborating with cross-functional teams to optimize assembly processes and ensure a seamless transition to mass production.
Responsibilities:
- Lead next generation Silicon Photonics package design in collaboration with cross-functional teams, stakeholders and vendors to ensure package requirements are met
- Own all the development of all the advanced packaging activities and designs: flip chip, reflow, fanout, thermo-compression bonding, underfill, hot bar soldering, wirebonding, etc…
- Optimize the assembly of electrical and optical engines and apply Design for Manufacturing principles to meet production volumes and cost targets
- Survey advanced SiPh packaging solutions, materials and vendors to stay current with new technological advancements
- Own and maintain the process and the manufacturing documentation, along with Bill of Materials for new products
- Drive package debug activities during product validation and qualification
- Support the development activities at our Contract Manufacturers, both remotely and on-site to ensure a smooth transition to mass production
Requirements:
- 5-8 years of experience in high-speed electronics and Silicon Photonics package design
- Experience with flip chip, fanout, thermo-compression bonding, underfill, hot bar soldering, wirebonding, die attach
- Experience in microelectronics, optoelectronics packaging design and assembly
- Knowledgeable in packaging technologies and processes, with glass/ceramic/metal material properties and multilayer materials interfaces after bonding
- Experience in high-volume packaging of optical transceivers, co-packaged optics, multi-chips module, pluggables, 2.5/ 3D packages
- Experience with documentation of fabrication, inspection, and assembly processes
- Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively
- Experience with package and process design/development from design to production
- Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience
- Familiar with optical coupling, fiber pigtail and free space optics
- Knowledgeable in materials properties and process, yield analysis and enhancement, failure mode and analysis, quality tools (such as DOE, SPC and Six-Sigma process and analysis)
- Familiar with Industry Test Standard, such as JEDEC, EIA, Telcordia, Mil-Std, etc
- Knowledge of material properties and associated mechanical part fabrication processes