We are looking for an NDT Level 2 Engineer for a long term contract with our aerospace client. This position requires an individual who possesses a thorough background and knowledge of Non-Destructive Testing to include: Radiographic Testing, Ultrasonic Testing, Magnetic Particle Testing, and Penetrant testing. A broad background in NDT of Castings, electronics, welding/brazing, composites, etc. is needed.
The selected candidate will be expected to perform various non-destructive testing tasks to support production operations, developmental design, and failure analysis. Some of the tasks will include onsite inspection of hardware, travel in support of requestors to perform evaluations offsite, development of new inspection techniques for qualified methods, etc. Collaboration with engineers is required to develop unique test plans, proper sequencing, and validate inspection techniques and setups.
The selected candidate must be able to manage a wide variety of tasks within schedule and budget requirements. Analysis and interpretation of results will be communicated with engineering customers and documented in engineering reports. The candidate will become part of a multi-disciplined team that is responsible for solving a wide range of technical problems.
Preferred Experience:
• Bachelor’s degree in Engineering
Experience interpreting and developing NDT Procedures and Technique sheets.
• Must be able to work in a stressful, on-demand environment and be able to communicate under duress in a non-confrontational, effective manner.
• Strong background in Non-Destructive Inspection of Aerospace products to include but not limited to: Composites, Castings, Welds, Braze Joints, Microcircuits, Computer Card Assemblies etc.
• NAS 410 Level 2 Certification in Ultrasonic Contact /Immersion / C SAM / Acoustic Microscopy Testing, Radiographic Film / Filmless Testing Fluorescent / Visible dye Penetrant Testing, Magnetic particle Wet / Dry Testing, & Visual / Weld inspections.
• Other Failure Analysis equipment (Digital / Optical Microscopes, Laser Milling, Die Shear/Bond Pull machine, Plasma Etching).
Required
