System Engineering / Product Definer — High-Power Management ICs & Smart Power Stages

Lucid Microsystems is seeking a System Engineering/Product Definer to develop and bring to market next-generation, high-efficiency GaN-based power management solutions. The role leads bench characterization, system-level validation, product definition, packaging and thermal integration, and technical customer enablement for Smart Power Stages and controllers used in AI data center CPUs and GPUs.

Responsibilities:

• Bench Characterization & Diagnostics: Lead hands-on lab characterization, debugging, and performance optimization of Smart Power Stages, driver ICs, and multiphase controllers under real-world AI workload dynamics
• Next generation, innovative product definition to solve the challenges related to AI based systems
• Silicon & GaN Evaluation: Evaluate and benchmark high-frequency, high-power density Si and GaN-based power stages, optimizing for power density, transient response, efficiency, and thermal dynamics
• Cross-Functional Collaboration: Partner closely with IC Design, Package Engineering, Systems Engineering, and Product/Test teams to translate system requirements into silicon/module definitions and resolve complex silicon and packaging anomalies
• Packaging & Thermal Integration: Provide application-level feedback on advanced power packaging technologies, including QFN, LGA, Fan-Out Panel Level Packaging (FO-PLP), and Chip-Embedded / substrate-embedded architectures
• Customer Technical Advocacy: Deliver reference designs, evaluation boards (EVBs), application notes, and direct engineering support to top-tier hyperscale and server OEM/ODM hardware teams

Requirements:

• B.S. in Electrical Engineering
• 10+ years of hands-on experience in high-power management IC development and application engineering
• Proven track record in high-density power solutions for AI servers, GPUs, CPUs, and enterprise computing
• Deep technical mastery in both Si-based MOSFETs/IC topologies and GaN power devices
• Strong familiarity with multiphase buck converters, switched-capacitor architectures, and point-of-load (PoL) topologies
• Expert-level capability in bench testing, high-bandwidth signal integrity measurements, loss breakdown analysis, thermal imaging, and high-frequency noise troubleshooting
• Deep understanding of power module assembly, parasitic inductance minimization, thermal dissipation paths, and layout constraints for LGA, QFN, FO-PLP, and chip-embedded packages
• Direct experience at leading power semiconductor organizations (e.g., •Infineon, Renesas, Monolithic Power Systems (MPS), Alpha and Omega Semiconductor (AOS), Analog Devices•, or similar
• M.S. or Ph.D. preferred with a focus on Power Electronics
• Direct experience working on power delivery architectures for low-voltage, ultra-high-current processor rails (e.g., sub-1V, 500A+ transient profiles)
• Strong familiarity with board-level layout design (Altium, Cadence Allegro) and power delivery network (PDN) simulation tools (SIMPLIS, SPICE, Ansys Q3D)