Senior Package Layout Engineer - Hardware

NVIDIA develops high-performance GPUs and SOCs and delivers innovative solutions across a wide range of sectors. The Senior Package Layout Engineer will design and develop sophisticated IC substrate layouts, collaborate with technical package and design teams, and address scheduling, cost, manufacturing, and electrical design considerations.

Responsibilities:

• As part of a Layout team, you will collaborate to implement high speed/density ASIC packages
• Perform substrate breakout patterns for ASIC packages
• Optimize package pinout incorporating system level trade-offs of pins assignment
• Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite
• Propose layout design trade-offs to the Technical Package Lead for resolution and implementation
• Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance
• Develop symbols and CAD library databases using Cadence APD design tools
• Develop methodologies to improve layout productivity

Requirements:

• Hold a B.S. Electrical Engineering or equivalent experience
• 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology
• Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
• Solid understanding of high-speed design signal integrity practices
• Experience with HDI designs is a plus
• Proven experience in substrate layout of wire bond and flip chip packages, preferred
• Experience with Virtuoso and Calibre is a plus
• Experience using Valor is helpful