Role Overview
Own the migration of CAD/CAE data migration into ENOVIA using Adaplet and/ or MQL / TCL scripts on the 3DX DEC platform and configure Adaplet-based data migration. Map legacy structures to the target model and ensure integrity of migrated design data.
Key Responsibilities
· Design and execute CAD/CAE data migration into ENOVIA using Adaplet connectors
· Develop MQL/TCL scripts as needed to migrate / extract data from / to Enovia
· Configure and maintain integrations for CATIA (native, backported), NX (via ITI connector) and Zuken.
· Mapping of types and relationships from legacy Enovia data model to 3DXperience Unified Product Structure
· Build extraction, transformation and load routines for large design datasets and validate results.
· Reconcile migrated BOM, part and document structures; resolve data-quality issues.
Required Qualifications
· 1-5 years in PLM data migration / CAD integration, ideally on ENOVIA 3DX DEC.
· Hands-on experience with Adaplet and at least one CAD connector (CATIA, NX, Zuken).
· Bachelor’s or master’s degree in engineering, Computer application or related majors.
· Proficient and hands-on experience with Dassault 3DX Enovia 2015x version (or any legacy version of 3DXperience)
· Hands on experience on 3DXperience’s Unified Product Structure (UPS/VPM) migration
· Expertise in managing, developing CAD integrations with Power’By and native Virtual Product Management in latest 3DXperience versions.
· Azure/AWS: Familiarity with cloud storage, secure file transfer, networking and access-control concepts (Good to have)
Skills & Competencies / Tools
· Technical: ENOVIA 3DEXPERIENCE Adaplet, CATIA/NX connectors, Power’By, 3DShape/VPM Reference, ETL and data migration, SQL Server, MQL, Tcl/Tk, data mapping, migration validation, and basic REST API knowledge
· Interpersonal: Collaboration across cross-functional teams, stakeholder communication, conflict resolution, and knowledge sharing.
· Analytical: Structured problem-solving, root-cause analysis, and data-driven decision-making.
