AACSG_Process Integration Engineer

职位描述

Key Responsibilities Own MEMS process integration for both new device development and sustaining production, spanning concept, prototyping, pilot, and mass production phases. Translate MEMS device designs into scalable, manufacturable process flows, with an emphasis on design-for-manufacturability and innovation. Drive R&D of novel materials, unit processes, and integration schemes to enable improved performance, cost, and robustness of MEMS microphones. Develop, optimize, and debug front-end and back-end MEMS processes, balancing trade-offs in yield, reliability, cost, and cycle time. Collaborate with foundry fab teams (TD/PI/module owners) to qualify and improve critical process steps (e.g., DRIE, wafer bonding, thin film deposition, lithography, release). Lead structured problem-solving efforts (FA/RCA) and implement corrective actions for yield excursions or reliability failures. Interface with cross-functional teams—design, test, packaging, and reliability—to ensure seamless process integration across the value chain. Support new material selection and experimental trials in coordination with internal labs and external research partners. Generate and maintain thorough documentation: process flows, work instructions, control plans, FMEA documentation, qualification reports. and support design reviews and tape-outs. Participate in technology roadmap discussions and early-stage prototyping, influencing future MEMS platform direction. Manage Lab-to-Fab and Fab-to-Fab process transfers, ensuring smooth NPI ramp-up and scalable manufacturing. Support patent generation, technical publications, and research proposals related to MEMS integration innovations.

职位要求

Required Qualifications Bachelor’s, or Master’s in Electrical Engineering, Materials Science, Mechanical Engineering, Microelectronics, or a related field. 1–5+ years of experience in MEMS process, process integration, semiconductor process development, or microfabrication R&D. Deep familiarity with MEMS inertial sensors or similar devices (e.g., Accelerometer, Gyroscope, pressure sensors, or micro speakers). Experience with MEMS process modules such as DRIE, sacrificial release, LPCVD/PECVD, wafer bonding, and hermetic sealing. Hands-on knowledge of cleanroom tools, metrology, FA methods, and analytical techniques (SEM, AFM, nanoindentation, profilometry, acoustic/electrical test). Experience conducting design-of-experiments (DOE), data analysis (e.g., JMP, Python), and process characterization. Excellent communication skills; fluent in English and Mandarin preferred for interfacing with regional partners. Proactive, creative thinker who thrives in a cross-disciplinary, fast-paced R&D environment.