Research Scientist Intern, Materials Architecture & Device Integration (PhD)

Meta’s Reality Labs Research is seeking innovative Research Scientist interns with a passion for technology to join our materials, manufacturing, and integration team at the research location in Redmond, WA. These roles are focused on the research and development of advanced materials, architectures, interconnects, and packaging technologies for integrating next-generation actuators, miniature motors, MEMS, and thermal management devices into AR/VR, wearable, and robotic systems. The ideal candidate will be a senior PhD student with a strong background in materials science, mechanical engineering, electrical engineering, or a related field; substantial hands-on experience in MEMS and microsystems integration; and a passion for turning new materials and processes into working devices.

Our internships are twelve (12) to twenty-four (24) weeks long and we have various start dates throughout the year. Some projects may require a minimum of 16 consecutive weeks.

About Reality Labs: Reality Labs is Meta’s research and development division dedicated to building the future of immersive technologies. Our mission is to advance the state of the art in virtual reality (VR), augmented reality (AR), and wearable devices to build systems that enhance human capabilities through intelligent machine collaboration and enable people to connect, collaborate, and experience the world in entirely new ways.

Responsibilities
Design, model, and fabricate novel interconnect structures with engineered geometries and surface chemistries to improve performance and reliability in low-temperature metal bonding, hybrid bonding, and 3D integration technologies.
* Identify and evaluate promising materials, device architectures, and manufacturing processes through literature review, multiphysics modeling, and screening experiments.
* Design and conduct lab and cleanroom experiments to integrate new materials and interconnects into packaged prototype devices, such as actuators, miniature motors, MEMS, or thermal management devices, and quantify device- and system-level performance.
* Develop and characterize test vehicles using microfabrication, wafer- and die-level bonding, additive manufacturing or other advanced techniques and evaluate electrical, mechanical, thermal, and environmental reliability.
* Document and communicate experimental plans, results, and design recommendations to both small and large groups of engineers and scientists.

Qualifications
Currently pursuing a PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics, or a related technical field
* 4+ years of hands-on experience in a laboratory environment, with a focus on MEMS or microsystems integration, advanced packaging, interconnects, robotics, actuators, wearable devices, or related areas
* Demonstrated experience with microfabrication techniques and working in cleanroom environments, ideally taking MEMS or semiconductor devices through fabrication, packaging, and system integration
* Experience with materials characterization, device testing, and/or failure analysis techniques (e.g., electron microscopy, cross-sectioning, scanning acoustic microscopy, X-ray imaging, and electrical, mechanical, or electromechanical testing)
* Must have or be able to obtain work authorization in the country of employment at the time of hire and maintain ongoing work authorization during employment
* Must obtain work authorization in country of employment at the time of hire, and maintain ongoing work authorization during employment
* Intent to return to full-time degree program after completion of the internship Knowledge of advanced packaging technologies (e.g., MEMS and wafer-level packaging, 3D integration), hands-on cleanroom experience, and proficiency in microfabrication, including photolithography, wet/dry etching, and deposition methods
* Familiarity with surface modification techniques (e.g., plasma activation, self-assembled monolayers, metal oxide coatings) and surface and interface characterization (e.g., contact angle, XPS, interfacial adhesion testing)
* Experience with multiphysics modeling, design, and testing of MEMS, actuators (e.g., electrostatic, electromagnetic, piezoelectric), miniature motors, or thermal management devices
* Previous experience with printed or sintered metal interconnects or low-temperature metal bonding, including processing and characterization of metal inks, pastes, powders, or composite materials for electronic applications
* Proven track record of research excellence as demonstrated by grants, fellowships, patents, as well as first-authored publications at leading workshops, conferences, or prestigious journals