Management of the full design flow of organic and ceramic multi-layers microelectronics packaging (BGA, PGA, CLCC, CQFP, WLCSP)
Identify customers’ needs.
Devise a solution and a specification.
Interact with packaging manufacturers to obtain a solution and a quote all along the design process.
Interacting with project teams (sensor designers, project manager…)
Implement the design + routing of the package in accordance with the constraints and timing as originally defined.
Conduct electrical, thermal and mechanical simulations when necessary.
Conduct DRC checks in accordance with e2v methodologies.
Conduct different design reviews including the final one before ordering the package.
Assume the role of design expert with respect to assembly houses (assembly instructions…)
Ensure technical interface with package vendors and assembly houses: Guide technical reviews with package vendors.
Technical Identification and evaluation of new vendors.
Technology monitoring: Maintain a technology watch on future generations of imaging packages.
Identify and lead R&D or continuous improvement projects on these technologies.

Background in microelectronics, in electronics (preferred), material science or micromechanics
First confirmed experience in packaging design. Specific experience in imaging and/or assembly would be a serious plus.
Mastering of package design flow: specification, identifying solutions, design, validation.
Mastering packaging layout meeting signal/power integrity aspects (under Cadence APD or equivalent).
Knowledge basic mechanical design (Solid works or equivalent).
Experience in technical management of package vendors and assembly houses.
A strong advantage would be Knowledge in electrical modelisation (parasitic extraction under Cadence Xtract IM, Spice, Ansys).
knowledge in thermal simulations (Ansys workbench, Solid works).
An experience in system and sub-system development.
A good level of English (B2 minimum) and French both oral and written. Spanish would be a plus.

Join an innovation‑driven environment in the Grenoble ecosystem, awarded 2026 European Capital of Innovation
Evolve within a human‑scale site where your contribution truly matters
Build your career through multiple development paths: technical expertise, project management, and international exposure within the Teledyne group (15,000 employees worldwide)
Enjoy a structured onboarding program with a dedicated mentor
Work in an attractive and flexible environment: teleworking agreement and real work–life balance
Join a company deeply committed to QHSE/CSR goals (2025–2030): “40 by 40” carbon plan, Gold‑level Pro Vélo certification, support to Handisport and Adapted Sport leagues
Be part of a culture built on respect, integrity, responsibility and citizenship
Evolve in a company committed to gender equality (score: 93/100)
Live in a unique Alpine environment, combining technological excellence with excellent quality of life

Package Design Engineer

Key skills