Function as the Taiwan-based point of contact for customer yield, providing day-to-day yield engagement and follow-up with Intel Foundry Customers.
Work in close partnership with the Yield DRI and factory teams in Intel Foundry FAB to align on root cause, recovery plans, and execution priorities.
Manage and support OSAT yield activities for Intel-owned ENG material, including yield monitoring, WIP management and ENG debug activities.
Collaborate with cross-functional engineering teams (device, integration, yield, lithography, etch, thin films, test) to maintain process stability and deliver technical solutions.
Identify process weaknesses and manufacturing tool issues using big data, statistical analysis, and advanced analytical methods.
Proactively identify yield risk, variability, and systemic trends, escalating issues with clear impact assessment and recommended actions.
Communicate yield status, risks, and recovery plans clearly to both technical teams and customer management when necessary.
Requirements
Bachelor's, Master's, or Ph.D. degree in Materials Science, Engineering, Electrical Engineering, Chemical Engineering, Physics, Chemistry, or a related scientific field.
Proficient in both English and Mandarin (written and verbal) to support customer, OSAT, and global factory interactions.
3 to 5 years of experience in semiconductor manufacturing, foundry, or yield engineering roles.
Strong analytical skills with direct participation and strong ownership.
Good and open communication skills, with the ability to work effectively in cross-functional and cross-cultural teams.
Experience supporting advanced logic technologies in high-volume manufacturing environments (preferred).
Experience in collaborating directly with customers and external manufacturing partners (OSATs) (preferred).