Bachelor’s degree in Electrical Engineering (BSEE); Master’s degree (MSEE) preferred
15+ years of experience in high-speed, mixed-signal IC design or architecture
Full-chip design lead or significant subsystem leadership experience through multiple full development cycles, including breakthrough product development
Extensive experience designing high-speed, high-resolution ADC, DAC and converter front end circuits for high-performance applications is required
Experience designing high-voltage, high-speed CMOS amplifiers
Experience designing optical and photonic interfaces, including TIAs, is desired
Familiarity with high-frequency communication channels, as well as frequency and time domain characterization and measurement techniques (such as TDR) is advantageous
Design lead experience of high-performance analog blocks, including: filters, VGA/PGA, variable analog delays, DLLs and charge pumps is a plus
Design expertise in FinFET or fine-line planar analog CMOS processes
Experience in software-defined CMOS communications or radar system design
Proficiency in digitally-assisted high-speed analog design
Excellent presentation and communication skills.

Principal Engineer, Mixed-Signal Design Engineering

Key skills