Define and drive the hybrid bonding technology roadmap
Lead module-level process development and execution for die-to-wafer hybrid bonding
Drive first-of-a-kind (FOK) equipment and platform development
Develop and implement strategies to address critical hybrid bonding challenges
Partner with equipment vendors and materials suppliers to develop enabling technologies
Collaborate across technology development, process integration, and manufacturing teams
Identify future technology needs and drive cross-organizational and external collaboration
Mentor and develop technical leaders and domain experts
Align technical strategies with organizational goals

Bachelor's degree + 15+ years of experience, or Master's degree + 10+ years of experience, or PhD + 8+ years of experience
Deep expertise in hybrid bonding, wafer bonding, or advanced packaging module development
Proven industry experience in hybrid bonding equipment development and process development
Process optimization, yield improvement, and reliability enhancement
First-of-a-kind (FOK) platform or equipment development and scaling to high-volume manufacturing (HVM)
Excellent communication and decision-making skills, with the ability to align technical vision with organizational and product goals.

Principal Engineer, Hybrid Bonding Module

Key skills