Build and lead a team to drive the R&D of complex, multi-chip modules utilising TSVs and microbumps, optimised to operate at millikelvin temperatures
Recruit, mentor, and lead a high-performing team of packaging, signal integrity, materials, and quantum integration engineers
Drive the strategy, design, and rapid prototyping of 3D integrated circuits and multi-chip quantum modules
Ensure all packaging architectures and interconnects can withstand thermal cycling down to millikelvin regimes without delamination or performance degradation
Own relevant operations with external foundries, OSATs, and research partners
Seamlessly transfer novel packaging designs to external manufacturing lines
Serve as the critical link between design, process integration, cryo R&D, and quantum hardware teams to co-optimise the electrical, thermal, and mechanical design
Balance rapid R&D prototyping with a rigorous, parallel focus on yield improvement, failure analysis, and long-term reliability

Master’s or PhD in electrical engineering, materials science, physics, microelectronics, or related field
7+ years deep technical experience in 3D integration, specifically with TSVs, fine-pitch microbumps, flip-chip bonding, and/or multi-chip modules
Proven track record or building, scaling, and managing engineering teams in high-tech, fast-paced environments
Strong experience managing technical transfers and working closely with external semiconductor foundries or advanced packaging facilities
Proficiency with industry-standard simulation tools (e.g., Ansys HFSS/Q3D, Cadence)
Direct experience with cryogenic electronics
Background or strong familiarity with solid-state quantum mechanics, silicon spin qubits, or semiconductor physics
Knowledge of materials behaviour (superconductors, low loss dielectrics) at extreme temperatures

Lead Engineer, 3D Integration – Advanced Packaging

Key skills