Lead and grow a global package layout team spanning different regions, including direct management of regional team leaders.
Define and drive the technical strategy and roadmap for package layout, ensuring alignment with Cisco Silicon One's product goals.
Own package design planning and scheduling from concept through implementation, ensuring on-time delivery across distributed teams.
Guide the optimization of package pinouts, stack-ups, power distribution, and high-speed routing, fostering collaboration with silicon floor planning, signal integrity, and power integrity teams globally.
Partner with vendors, drive innovation, and establish best practices that elevate the quality and efficiency of the projects.
Recruit, develop, and retain top layout engineering talent across regions, creating a high-performing, cohesive, and inclusive global team.

Bachelor's or Master's degree in Electrical Engineering or a related field
At least 7 years of experience in Package Layout
Strong understanding of high-speed signal design, power distribution networks (PDN), and IC package design principles
Experience with industry-standard EDA tools for package layout and design
Excellent verbal and written English communication skills
Experience managing remote or globally distributed engineering teams (Preferred)
Proficiency in Cadence APD+ or equivalent IC package EDA tools (Preferred)
Experience in ASIC package layout design, including pinout optimization and high-speed routing (Preferred)
Knowledge of silicon floor planning, SI, and PI considerations at the package level (Preferred)
Track record of driving design methodology improvements and delivering results through others (Preferred)
Experience working with global vendors and managing outsourced layout activities (Preferred)
Scripting experience in Python, Perl, or TCL (Preferred).

IC Package Layout Manager

Key skills