Key skills
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About this role
Molex is seeking a Principal Signal Integrity Design Engineer to join our Optical Solutions Business Unit (OSBU). In this role, the successful candidate will design, implement, and validate advanced RF interconnects for photonic integrated circuits and collaborate with global teams to develop next-generation photonic solutions.
Responsibilities:
- Lead the R&D, design, and EVT/DVT activities with regards to developing advanced integrated RF interconnect solutions for 400G/L PAM4, CPO, and 1.6T/3.2T coherent products
- Collaborate with the SI/PI, opto-mechanics, packaging, and test and reliability teams to provide appropriate test vehicles for EVT/DVT of advanced integrated RF interconnects
- Work with external partners, foundries, contract manufacturers, and OSATs to develop required processes and demonstrate production level performance, reliability, and quality
- Intimately collaborate with the SI/PI and transceiver design teams to build and validate predictive RF models for pluggables and transponders including external ASICs components such as DRV, TIA, DSP (LPO, LRO)
- Collaborate with the PIC component design and PDK teams in developing advanced modulator devices for the next generation of PIC products
- Mentor other SI/PI engineers and cross functional groups on advanced EM simulation and design techniques based on commercial software tools and custom codes
Requirements:
- PhD typically in Electrical Engineering, Microwave Photonics, Physics or related technical fields
- At least 10 years of relevant industry experience in designing advanced RF interconnects and/or signal/power integrity for optical connectivity applications
- Expertise of Si and/or III-V photonic integrated circuits (PICs)
- Experience with CMOS semiconductor and backend processes as well as packaging ecosystem
- Expert level user of commercial modeling tools such as Ansys HFSS, ADS, or equivalent software