Director, Advanced Package and 3DIC Solutions
San Jose, Texas, United States of America
Full Time
2 hours ago
$157,500 - $292,500 USD
H1B Sponsor
Key skills
RCommunication
About this role
Role Overview
- defining and leading the development of advanced packaging and 3DIC implementation flows for foundry and customer solutions
- develop excellent working relationships with Cadence R&D and product engineering teams as well as customers
- management responsibilities may be added to this role as the 3DIC services team is staffed up
- implement bondwires, bumps and 3D structures and designs
Requirements
- Bachelor’s degree (Masters preferred) in Electrical or Electronics Engineering
- Minimum 20 years experience with package design
- 10 years experience as an APD expert
- Strong knowledge of advanced packaging concepts
- Strong knowledge of 2.5D, 3DIC and stacked die technologies
- Understanding of chip level CMOS design concepts desired
- Good programming knowledge with Allegro Skill and Ravel a plus
- Strong customer-facing communication and problem-solving skills
- Strong personal drive for continuous learning and expanding professional skill sets
- Excellent verbal and written communication skills
Benefits
- paid vacation and paid holidays
- 401(k) plan with employer match
- employee stock purchase plan
- a variety of medical, dental and vision plan options
- more