Support customers with package designs that meet challenging electrical requirements
Advance Marvell's expertise in 3D packaging, Co-packaged optics and cutting-edge substrate materials
Work with the world's leading manufacturers to solve client’s most challenging designs
Collaborate with internal teams and external partners for package assembly development

Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5
8 years of related professional experience or Master’s/PhD with 1-3 years of experience
Experience with 2.5D package design and development
Using IC package layout tools like Cadence APD or Mentor XPD
Understanding IC package design requirements for high speed interfaces and setup constraints manager
Interface with the IC physical design teams for optimizing the ASIC die floor plan
Experience in interfacing with Substrate suppliers, OSATs and Silicon fab vendors
Experience in working with IC package assembly development teams and understanding assembly requirements
Experience with IC layout tools is highly desired
Ability to do automation of the layout tasks using scripting
Power plane design and translating power supply requirements into design
Familiarity with IC packaging technologies, materials, substrate design rules and assembly rules
Track record of new product introduction from concept through development and production is a plus
Knowledge of the thermal and mechanical analysis of the IC package development is a plus

Senior Staff Engineer – Package Layout Design

Key skills