Own the process application and performance of the die bonder product portfolio across key packaging segments
Define product requirements, use‑case scenarios, and application benchmarks for new platforms or modules
Lead die attach development, qualification, and NPI ramp to high‑volume manufacturing
Drive yield, reliability, and downtime reduction through structured data analysis and root cause analysis
Set technical direction for die bond equipment strategy, automation, and future technologies
Act as senior escalation point and technical authority for complex product and customer issues
Lead, mentor, and develop a team of product and application engineers with strong competence in die attach applications, tool capability, and problem‑solving
Partner with R&D, Manufacturing, Quality, and Supply Chain to deliver robust, scalable solutions
Ensure die bonder products remain competitive in performance, flexibility, reliability, and total cost of ownership

Bachelor or Master degree in Engineering or related discipline
10yrs+ experience in Semiconductor backend or high precision equipment manufacturing
Advanced disciplinary knowledge and expertise in product management
Proven leadership in product engineering, NPI, and mass production environments
Able to balance technical depth with strategic decision‑making and people leadership
Team builder and player, with strong cultural awareness
Sound skill in leading cooperative efforts across different teams to deliver results
Good communication skills
Able to speak Mandarin and/or Cantonese will be a plus.

Senior Manager, Die Bond Product Engineering

Key skills