Global Head of Embedded Electronics Engineering

Cintal, Inc. is a forward-thinking global technology company that develops and provides cutting-edge products and services across various industries. They are seeking a highly experienced Global Head of Embedded Engineering to lead the strategy, growth, and global delivery of embedded systems and advanced electronics engineering services.

Responsibilities:

• Define the global strategy for embedded systems engineering services
• Expand embedded hardware, firmware, and software capabilities
• Drive innovation in connected products and advanced electronics
• Own revenue growth, margin performance, and operational efficiency
• Manage budgeting, forecasting, and financial performance
• Develop executive relationships with international customers
• Lead proposals, pricing discussions, and commercial negotiations
• Support customer product development programs
• Lead global embedded engineering teams
• Ensure high-quality delivery of hardware and firmware programs
• Establish scalable development and validation frameworks
• Provide Subject Matter Leadership Across Embedded hardware architecture
• Firmware development and real-time systems
• Embedded Linux and RTOS environments
• Electronics design and validation
• System integration and product development
• Domestic and international travel is required to support customers and global teams

Requirements:

• Master's degree+ in Embedded Systems Engineering, Electrical Engineering, Electronics Engineering, Computer Engineering, or related field
• 15–20 years of experience in one or more of the following industries (mandatory): Heavy engineering, Earth moving equipment, Automotive, Industrial equipment
• Strategic thinker with entrepreneurial mindset
• Strong commercial acumen
• Excellent communication and stakeholder management skills
• Ability to operate in a global matrix organization
• High emotional intelligence and cultural awareness
• Proven experience managing large, multi-location engineering teams
• Significant international customer interaction experience
• Demonstrated P&L or revenue responsibility
• Strong executive presence and leadership maturity
• Deep expertise in Embedded Electronics Engineering
• Embedded hardware design (analog/digital, PCB design, power management)
• Microcontrollers, SoCs, RTOS, Linux-based systems
• Firmware architecture and C/C++ development
• Communication protocols (CAN, SPI, I2C, Ethernet, BLE, Wi-Fi, etc.)
• Knowledge of global embedded electronics standards and compliance
• ERP systems (SAP, Oracle, or equivalent)
• PLM systems (Teamcenter, Windchill, or similar)
• Advanced Excel & data-driven decision making
• KPI dashboards and performance analytics
• Embedded C/C++ best practices
• Memory management in constrained systems
• Bootloaders and secure startup sequences
• Board Support Package (BSP) architecture
• Driver development
• Middleware integration
• Over-the-air update architectures
• Advanced System Architecture Expertise
• High-Performance Digital & Processing Systems
• Functional Safety & Compliance Leadership
• Embedded Cybersecurity Expertise
• Digital Engineering & Automation
• Connectivity & Edge Integration
• Reliability & Robustness Engineering
• Innovation & Emerging Technology Acumen
• Technical Due Diligence & Executive Advisory Capability