Camera and Depth Systems Engineer

We are looking for a Camera and Depth Systems Engineer to drive the development, industrialization, and continuous improvement of optical sensing modules, including camera, depth and ALS modules, for high-volume consumer products. You will partner with internal cross-functional teams and external suppliers to deliver robust module designs, enable scalable assembly processes, and contribute to innovation in optical sensing module architectures.

Responsibilities
Own system-level technical execution for optical sensing modules (camera and/or depth), from concept through mass production
* Define and refine module requirements and specifications, including optical, mechanical, electrical, thermal, reliability, and manufacturing constraints
* Drive module assembly and packaging development, including tolerance stack-up, process windows, manufacturability (DFM/DFA), and yield improvement
* Collaborate with EE/firmware/system teams on electrical interface definitions, bring-up support, and module-level debugging/troubleshooting
* Lead cross-functional investigations for factory yield issues, field returns, and reliability failures; coordinate FA, corrective actions, and prevention plans
* Analyze production/test data to identify trends, quantify risks, and prioritize improvement opportunities; communicate results to technical and non-technical stakeholders
* Engage with suppliers and CM partners to review process capability, qualification plans, control plans, and validation data
* Contribute to optical sensing module innovation (new packaging approaches, architectures, materials, test strategies, and manufacturing methods)
* Travel to vendor/manufacturing sites as needed to support builds, issue resolution, and production readiness

Qualifications
BS/MS in Optical Engineering, Mechanical Engineering, Electrical Engineering, Physics, or a related field
* 2+ years of industry experience in optical sensing modules (e.g., camera modules, depth modules, ToF, structured light, stereo, active illumination systems) for consumer electronics or similar high-volume products
* Familiarity with typical camera/depth module assembly flows (alignment, bonding/adhesives, curing, cleanliness/contamination control, calibration/test, rework considerations)
* Knowledge of module packaging technologies and manufacturing methods (examples: active/passive alignment, wafer-level optics (WLO), lens barrel/holder assemblies, cover glass integration, OIS/actuator integration where applicable)
* Understanding of electrical interfaces and module integration basics (connectors/FPC, signal integrity considerations at a practical level, ESD handling, power/grounding basics, module-level debug support)
* Demonstrated experience with using data to drive decisions (yield, parametric trends, reliability data, test limits, Cp/Cpk/SPC concepts)
* Experience in cross-functional communication and experience in leading technical discussions with internal teams and external vendors
* Willingness to travel domestically/internationally (typically up to ~10%) Experience taking an optical module from early development through ramp and sustaining in mass production
* Depth sensing experience with active illumination (VCSEL/LED), diffractive optical elements (DOE), optical filters, and system calibration approaches
* Experience with FA methods and tools relevant to optical modules (e.g., decap/physical inspection, metrology, optical inspection, adhesive/contamination analysis, environmental/reliability stress correlation)
* Familiarity with high-volume test strategies for optical modules (end-of-line test, calibration flows, guardbanding, measurement system analysis)
* Supplier management experience (process audits, PPAP-like qualification thinking, control plans, change control/PCN handling)