Senior Connector Development Engineer

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, designs and manufactures high-performance interconnect solutions for technology applications. The Senior Connector Development Engineer will lead the design and development of next-generation connectors and cable assemblies, collaborating with customers and global cross-functional teams while overseeing prototyping, qualification, cost analysis, and manufacturing support.

Responsibilities:

• Lead the planning, design, and execution of connector and interconnect development projects from concept through evaluation and qualification
• Design high-speed connectors, power connectors, and cable assemblies, including card edge, memory, and storage connectors
• Collaborate with global customers and cross-functional teams to define requirements and deliver innovative interconnect solutions
• Apply knowledge of server/storage architectures, industry standards (PCI-SIG, OCP, JEDEC, SFF), and signal integrity principles
• Develop prototypes, oversee testing/qualification, and ensure compliance with industry and customer performance standards
• Conduct cost analysis, provide design trade-offs, and support decisions for product management and manufacturing
• Benchmark competitive products to drive differentiation in performance, cost, and manufacturability
• Provide technical support to Sales and Marketing, including customer training, presentations, and direct engagement
• Partner with Manufacturing to address cost reduction, quality improvement, and customer issue resolution
• Stay current with technology trends and emerging interconnect solutions—including power interconnect innovations—to guide future product development

Requirements:

• Bachelor's degree in mechanical engineering, Electrical Engineering, or a related technical field
• 8+ years of experience in connector and/or cable assembly design and development
• Proven experience with card edge, memory, power connectors, and high-speed cable assemblies
• Familiarity with industry standards such as PCIe, DDR, OCP, JEDEC, and SFF
• Strong analytical, problem-solving, and design skills
• Excellent communication and interpersonal skills with the ability to collaborate across global teams
• Proficiency in 3D modeling tools (e.g., Creo) and Product Data Management systems (e.g., Windchill) preferred