Marketing Manager, Innovation Products

EMD Electronics is seeking a Marketing Manager, Innovation Products to define, develop, and commercialize High Performance Packaging product lines within its Electronics Patterning Business Unit. The role leads market intelligence, portfolio and opportunity management, pricing strategy, and customer and cross-functional engagement for advanced packaging solutions.

Responsibilities:

• Responsible for the strategy and marketing of Patterning Materials including Electron Inks products in Advanced Packaging applications
• Competent in developing market intelligence for advanced packaging materials market, updating assessments of Market size, competitive position, market trends, working with GMMs for Photoresists, Cleans, other patterning products, as applicable
• Through technical expertise, identify and stay ahead of key High Performance Packaging (Advanced Packaging) technology inflection points and roadmaps
• Through industry/ecosystem connections continue to acquire in-depth strategic knowledge of customer and OEM roadmaps
• Leverage industry network and connections to engage the ecosystem on collaborative development opportunities
• Leverage deep technical knowledge to ensure development programs are identifying and meeting industry standard datasets
• Ensure development programs are leveraging industry expertise to deliver relevant datasets in the timeliest manner
• Co-Lead opportunity management of Thick Film Resist, SP&C products and other patterning products used in Advanced Packaging working closely with Sales and Applications teams
• Work closely with the GMM Innovation- Photoresist to implement the PFAS free portfolio; Cleans, and other patterning products relevant to advanced packaging
• Represent EMD Electronics in industry related conferences
• Establish pricing strategy and set pricing corridors by product, region, customer type and volume
• Quick response to cross functional teams and customers
• Close collaboration with sourcing team and toller management

Requirements:

• External applicants must be eligible to work in the US
• Bachelor's degree in chemistry, marketing, business, or a related field
• 5+ years of experience in the semiconductor industry, with a strong knowledge/experience in High-Performance Packaging (advanced packaging) technologies
• Demonstrated ability to collaborate effectively across functions and cultures within a complex matrix organization
• Inspiring leadership skills, with the ability to motivate teams and drive projects forward
• Demonstrated ability to uncover underlying customer and supplier needs through effective questioning and active listening
• Skills such as project management and design of experiments are a big plus for this position
• Experience with Advanced Packaging Technologies used at Foundries, OSATs or IDMs
• Advanced degree, such as an MBA or PhD
• 8+ years of direct working experience in the field of advanced packaging
• Strong communication skills, with the ability to positively influence cross-functional teams and peers
• Deep technical understanding of state-of-the-art advanced packaging technologies
• Self-starter, ability to operate with little direction