Technical Program Manager II (PCB Design)

Tailored Management is seeking an experienced Technical Program Manager to drive the design and development of advanced flexible and rigid printed circuit boards for AR wearable devices. This role involves owning end-to-end PCB development, collaborating cross-functionally, and ensuring robust design integration throughout the product lifecycle.

Responsibilities:

• Own end-to-end PCB development for AR wearable products, including schematics, layout, form factor development, fabrication, and vendor approval
• Lead design releases for flex circuits and multi-layer boards (MLBs) from early architecture through production ramp
• Partner cross-functionally with Electrical Engineering, Mechanical Engineering, Operations, and Supply Chain teams to ensure robust design integration
• Drive SMT (Surface Mount Technology) and FATP (Final Assembly, Test, and Pack) builds, optimizing for quality, yield, and schedule adherence
• Collaborate closely with APAC contract manufacturers and flex vendors to ensure supplier readiness and manufacturing excellence
• Proactively identify technical risks, manage schedules, and implement mitigation strategies throughout development cycles
• Support integration of miniaturized electrical components into highly compact, performance-driven wearable designs
• Accommodate cross-regional collaboration, including working outside standard hours as needed to support APAC partners

Requirements:

• 5+ years of experience in electrical design, PCB development, or hardware engineering
• Proven ownership of flex and multi-layer PCB design releases through full product lifecycle (concept to production)
• Hands-on experience managing SMT and FATP builds, including yield and quality optimization
• Direct experience working with APAC contract manufacturers and managing vendor relationships
• Strong understanding of PCB fabrication processes, materials, and DFM best practices
• Experience developing AR wearable devices or consumer wearable electronics
• Expertise in small-component integration within ultra-compact form factors
• Familiarity with advanced PCB technologies (HDI, rigid-flex, microvias, high-speed design considerations)
• Strong cross-functional communication and project management skills in high-volume consumer electronics environments
• Degree in Electrical Engineering or related field preferred, but not required