Define and drive panel scaling technology strategy and customer-facing execution across next-generation advanced packaging and substrate platforms
Lead cross-functional alignment to accelerate panel-level form factor scaling, RDL scaling, and ecosystem readiness
Build and manage a partner ecosystem spanning substrate makers, material suppliers, OSATs, foundries, and research institutes
Drive internal alignment across engineering, product lines, marketing, and finance on portfolio gaps and priorities
Create a mechanism to communicate issues, track progress and pull resources from multiple divisions and/or functions
Serves as the customer expert across a broad range of exceptionally complex products
Directs the positioning of new technologies to customers utilizing technical information from divisions

15+ years experience in semiconductor packaging, substrates, panel processing, lithography/patterning, deposition/etch, or adjacent advanced manufacturing domains
Demonstrated leadership in technology strategy + customer execution
Strong working knowledge of advanced packaging drivers: panel form factor scaling, RDL scaling, TGV/glass & organic substrate trends, and manufacturing/yield constraints at large format
Proven ability to lead cross-functional organizations and influence without direct authority across engineering, product teams, and external partners
Executive communication strength: translating complex technical tradeoffs into business outcomes and decisions.
PhD/MS in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or equivalent experience (preferred)
Prior experience launching new platforms (e.g., panel-based process modules, integrated packaging lines, or disruptive substrate architectures) (preferred)

Supportive work culture that encourages learning, development, and career growth
Health and wellbeing programs

Senior Director, Advanced Packaging Disruptive Technology

Key skills