SI/PI for 3DIC Sr Principle Solutions Engineer

Cadence is a technology company focused on developing leaders and innovators. They are seeking a Senior Principal Solutions Engineer to define and lead the development of advanced packaging and 3DIC analysis flows for foundry and customer solutions.

Responsibilities:

• Define and lead the development of advanced packaging and 3DIC analysis flows for foundry and customer solutions
• Analyze the customer's environment and evaluate appropriate solutions
• Anticipate technical issues and develop creative solutions before they become a problem
• Take technical lead on a wide range of projects
• Understand high-speed, high-performance signal and power integrity-related issues
• Communicate effectively with Cadence R&D, Product Engineering, Marketing, and with customers
• Understand customer success criteria and ensure customer success

Requirements:

• Bachelor's degree in Electrical or Electronics Engineering
• Minimum 15 years experience with Signal Integrity, Power Integrity, Electromagnetics, Thermal, and RF related to Package and PCB Design
• 5+ years experience with Cadence SI/PI tools Allegro platform tools including: Sigrity, Clarity, PCB Editor, ICP
• Strong knowledge of advanced packaging concepts
• Strong knowledge of 2.5D, 3DIC and stacked die technologies
• Understanding of chip level CMOS design concepts
• Strong customer-facing communication and problem-solving skills
• Strong personal drive for continuous learning and expanding professional skill sets
• Excellent verbal and written communication skills
• Masters degree in Electrical or Electronics Engineering